Molex has introduced a surface-mount version of its right-angle SMT headers for the next-generation HSAutoLink™ Interconnect System.
The Molex HSAutoLink™ Interconnect System leverages high-speed technologies to meet rising data bandwidth in vehicle-to- vehicle communications, infotainment and telematics in the connected vehicle segment. The ruggedized, industry-standard USCAR-30 right-angle SMT header is compliant with all USB 2.0, LVDS (Low-Voltage Differential Signaling) and BroadR-Reach automotive Ethernet electrical and EMI (electromagnetic interference) shielding requirements for automotive and commercial vehicle applications.
“The new SMT right-angle header for the HSAutoLink™ Interconnect System gives customers an additional mounting option for manufacturing process optimization,” said Laurent Stickeir, global product manager, Molex. “The one-piece design ensures a high-integrity, robust connector interface.”
The Molex right-angle SMT header design optimizes available reverse-side PCB space. The innovative side ribs on the housing provide PCB stabilization during one-step processing. The high-temperature- rated plastic housing safeguards all the internals during lead-free, reflow soldering. Flexible packaging options, including both rigid tray
and tape and reel, support fully automated assembly. Several color-coded keying options are also available